Rowley Spring and Stamping Corp. fabricates custom springs and stampings for electronics applications down to the size of 2mm x 2mm x 4mm and packages them within EIA standards for those who utilize surface mount applications. Our methods of packaging allow us to handle varying volumes to satisfy customer annual requirements.
Fabricated stamped components are either formed or produced from solid stock, depending on customer design. These components are packaged utilizing a number of different methods. Formed components are typically produced on a strip and packaged using a secondary automated method. Solid components, contacts and terminals are bowl fed for orientation and then placed in the appropriate carrier tapes.
Rowley custom designs and builds the automated packaging systems to accommodate a wide variety of part configurations. Utilizing state of the art vision systems, inspection is done in line where specific part orientation is required.